Epoxy Adhesives

  • Temporary Bonding
  • Two Component
  • Heat Release
  • Quick Cure

VALTRON® epoxy adhesive systems are available in various formulations designed to meet the specific needs and performance requirements in photovoltaic (solar) and semiconductor wafer production using both annular (ID) slicing and wire saw slicing processes. These patented two-component quick-curing adhesive systems are made with unique components and offer performance characteristics that maximize production throughput and reduce the amount of stress occurring between the crystalline ingot and the adhesive. This reduction in thermal stress from curing results in a decrease in the amount of edge chips that occur during ID slicing. VALTRON® adhesives prevent ID blade loading onto the annular saw and will eliminate saw marks, increase saw blade life, and improve slicing yields. Easy removal of the epoxy adhesive from the sliced wafers with a VALTRON® heated detergent solution eliminates the need for aggressive acids, caustics, and solvents. VALTRON® adhesives are color pigmented to easily indicate when a complete mix of resin and hardener is achieved, and provide fast cure times at room temperature to improve increased productivity.

Annular (ID) Slicing

Annular (ID) Slicing

VALTRON® epoxy adhesives are designed for the annular (ID) slicing process. Unique components are incorporated into product formulations to reduce the amount of physical stress occurring between the crystalline material and the epoxy adhesives. This reduction in stress results in a decrease in the amount of exit chips that occur during slicing. These epoxies are also designed to prevent loading onto the annular saw blade and will eliminate saw marks and increase saw blade life.

Wire Saw Slicing

Valtech Corporation has developed adhesive products designed specifically for the wire slicing process. These quick curing adhesive systems were developed to maximize production throughput. Removal of the epoxy from the sliced wafers is easily accomplished with a heated VALTRON® detergent solution, eliminating the need for aggressive acids and solvents.

Temporary Bonding Adhesives

VALTRON® temporary bonding adhesives are two-part epoxies that are formulated for easy debonding from substrates offering an alternative to wax mounting of parts with the added benefit of easier cleaning. VALTRON® temporary adhesives are strong enough to support typical slicing or machining operations after a one-hour cure time at room temperature. Following the cutting or machining process, parts are easily dismounted from any substrate by placing in hot water at a temperature of range of 90 – 95°C (203°F). Sufficient volume of hot water (preferably DI) is required so water temperature does not drop below 90°C when parts are placed in the demounting bath. This same bonding adhesive technology can also be used as a temporary protective coating for sensitive components.


切片技术首席执行官 基思·罗宾逊







Sydor Optics, Inc.

十多年来,我们一直是湾泰的客户。作为一名质量和环境专业人员,我的责任是在公司内努力追求和实现卓越的完美。我非常重视优秀的客户服务。近来,由于我们的工业废水排放许可证缘故,我们面临着环境挑战。湾泰的客户和技术服务专业人员很快就解决了这个问题,在这个过程中,湾泰给了我们高质优美的贵宾级服务, 让我感到非常满意。”

美国冈泽质量与环境经理 迈克尔·梅里特

Gunze USA




哈里斯运营管理高级主管, 玛丽·万克里夫